MtronPTI組件設(shè)計和測試能力遙遙領(lǐng)先

MtronPTI高功率處理空間級組件和子組件的設(shè)計和測試能力

MtronPTI has over 125 design wins across satellite platforms and manned spacecraft. With expertise supporting LEO, MEO and GEO applications, MtronPTI has a well-established team and a proven track record to meet demanding space requirements.

With the evolving need for high-power space-level transmitters, high-power handling space-level RF components and sub-assemblies are instrumental for mission success. The performance of these devices used in orbiting satellites are significantly different compared to how they perform at sea level due to phenomena like multipaction. Some space-level applications require both continuous operation performance in outer space as well as performance during the assent to space, i.e. undergoing a pressure change from ambient to 1 x 10-5 Torr over temperature to avoid corona discharge. Understanding the capability of the high-power handling RF components and sub-assemblies during the assent to space and in orbit is critical for successful space missions. Detecting potential risks at an early stage prevents a catastrophic failure.

In addition to existing in-house testing capabilities1 for testing space level components and RF assemblies, MtronPTI has invested in simulation tools like Spark3D™ to maximize power handling capability under vacuum in the early stages of the design process. MtronPTI has also invested in a altitude (hypobaric) chamber to support high power handling RF components and sub-assemblies testing. The incorporation of an altitude test chamber enables MtronPTI to adjust the temperature of the environmental test chamber while exposing the product under test to pressure approaching 1 x 10-5 Torr. By combining Spark3D simulations and altitude testing, MtronPTI enhances the probability of mission success.

MtronPTI space-level products comply with ANSI/AIAA S-142-2016, Standard/Handbook for Multipactor Breakdown Prevention in Spacecraft Components.

Note 1 : MtronPTI’s extensive in-house test capabilities include Thermal Shock per MIL-STD-202, Method 107 • Terminal Strength per MIL-STD-202, Method 211 • Mechanical Shock per MIL-STD-202, Method 213 • Gross Leak Testing per MIL-STD-202, Method 112 • Random Vibration per MIL-STD-202, Method 214A • Fine Leak Testing – Helium per MIL-STD-202, Method 112 • Sinusoidal Vibration per MIL-STD-202, Method 201 and 204 • PIND (Particle Impact Noise Detection) per MIL-STD-202, Method 217 • Other Miscellaneous Testing including: Life, Immersion, Humidity, Barometric Pressure, Solderability • Dielectric Withstanding Voltage, Insulation Resistance, RF Testing 100 kHz to 40 GHz.

高空模擬室

MtronPTI組件設(shè)計和測試能力遙遙領(lǐng)先

MtronPTI麥特倫皮晶振在衛(wèi)星平臺和載人航天器方面贏得了超過125項設(shè)計。憑借支持LEO、MEO和GEO應(yīng)用的專業(yè)知識，MtronPTI麥特倫皮晶振擁有一支經(jīng)驗豐富的團隊，并有著滿足苛刻空間要求的良好記錄。

隨著對高功率空間級發(fā)射機需求的不斷增長，高功率處理空間級射頻組件和子組件對任務(wù)的成功至關(guān)重要。由于多重作用等現(xiàn)象，在軌道衛(wèi)星上使用的這些設(shè)備的性能與它們在海平面上的性能相比有很大不同。一些空間級應(yīng)用既要求在外層空間的連續(xù)運行性能，也要求在進入空間期間的性能，石英晶體振蕩器，即在溫度范圍內(nèi)經(jīng)歷從環(huán)境壓力到1×10-5托的壓力變化，以避免電暈放電。了解進入太空和在軌期間高功率處理射頻組件和子組件的能力對于成功的太空任務(wù)至關(guān)重要。在早期發(fā)現(xiàn)潛在風(fēng)險可以防止災(zāi)難性的失敗。

除了現(xiàn)有的內(nèi)部測試能力1為了測試空間級元件和RF組件，MtronPTI石英晶振投資了Spark3D等模擬工具，以便在設(shè)計過程的早期階段最大限度地提高真空下的功率處理能力。MtronPTI還投資了一個高海拔(低壓)試驗箱，以支持高功率處理RF組件和子組件測試。海拔試驗箱的引入使MtronPTI能夠在將產(chǎn)品暴露在接近1 x 10的壓力下時調(diào)節(jié)環(huán)境試驗箱的溫度-5托。通過結(jié)合Spark3D模擬和高空測試，MtronPTI麥特倫皮晶振提高了任務(wù)成功的概率。

進口晶振MtronPTI航天級產(chǎn)品符合ANSI/AIAA S-142-2016《航天器部件中的二次放電擊穿預(yù)防標準/手冊》。

注1 : MtronPTI廣泛的內(nèi)部測試能力包括根據(jù)MIL-STD-202的熱沖擊，方法107根據(jù)MIL-STD-202的終端強度，方法211根據(jù)MIL-STD-202的機械沖擊，方法213根據(jù)MIL-STD-202的總泄漏測試，方法112根據(jù)MIL-STD-202的隨機振動，方法214A精細泄漏測試-根據(jù)MIL-STD-202的氦氣，方法112根據(jù)MIL-STD-202的正弦振動。